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BMC Firmware Engineer应届生
天弘(东莞)科技有限公司 研发部 广东东莞 2天前刷新
学历要求本科 工作经验应届毕业生 现居住地不限

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职位介绍

Job description:
You will join Software Department of Celestica Global Design Service as a senior BMC firmware engineer. In this position, you will be responsible to develop and/or customize BMC firmware platforms for various storage products (RAID controllers, disk array enclosures, network attached storage systems, and storage servers) and server products (Rack mount server, Blade server, converged server) and enterprise network switch product and deliver turn-key solutions for customers. Your responsibilities will include but not be limited to:
Design requirements analysis based on inputs from customer or business/marketing groups or system architects.
Create firmware architecture design and/or module design specifications and drive detailed design activities including coding, code inspection, unit test, integration test and functional verification.
Conduct detailed design efforts. Closely monitor detailed design progress and publish status report timely.
Coordinate firmware test/verification and debug, support system integration and validation. Manage issues/defects and drive root cause analysis/bug fix.
Work with design PM and quality specialists to make and meet commitments for quality, deliverables, and schedule.
Contribute to software development process evolution.
Qualification:
Master or Bachelor's degree in Computer Science, Computer Engineering, or Electrical Engineering or equivalent.
Solid C programming skills.
Working experience on embedded software development.
Be familiar with Linux programming and operation.
Working Experience of BMC firmware development and IPMI.
Working knowledge of common bus such as I2C, PMBUS, SPI, LPC, UART, JTAG.
Experience with PSoC or MCU firmware development is a plus.
Experience with network protocol TCP/UDP is a plus.
5629 8270-|171 1704 4321 11Excellent interpersonal and communication skills in both English and Mandarin as the position may require direct communication with customers.

公司信息
行业:
电子技术、半导体、集成电路
规模:
1000人以上
地址:
广东东莞东莞松山湖科技产业园区北部工业区(金威啤酒厂斜对面)